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TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

Επωνυμία: KHJ
Αριθμός μοντέλου: TS650RN
Πληροφορίες λεπτομέρειας
Τόπος καταγωγής:
Shenzhen Κίνα
Πιστοποίηση:
ROHS
Χρώμα:
Λευκός ημιδιαφανής
Ολικό πάχος:
0,153±0,005 χλστ
Περιγραφή προϊόντων
Description TS650RN is a white translucent thermal separation tape with high initial viscosity. At a certain temperature (110~140℃), the adhesive surface foams and viscosity disappears, allowing automatic separation from the adhered object. Construction Features * Easily peeled off by heat treatment at any time * Initial temperature resistance and will not Anti-stick * RoHS Compliant Application * This product is suitable for temporarily fixing various types of components