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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ

TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ

Επωνυμία: KHJ
Αριθμός μοντέλου: TS652D
Πληροφορίες λεπτομέρειας
Τόπος καταγωγής:
ΣΕΝΤΖΕΝ
Πιστοποίηση:
RoHS
Περιγραφή προϊόντων
Description TS652D is a white film backed pressure-sensitive adhesive single- sided coated thermal release tape.With a high initial adhesion and easily peel off by heating under a certain high temperature (110-140°C) . Features * High initial adhesion and certain heat resistance ,no sticking back * After heating ,easy to peel off and no any residual. * Excellent tensile strength & Elongation * RoHS Compliant Application * For electronic component ,glasses ,wafer ,ceramics